×
img

伯恩斯坦:中国半导体设备:2025年中国晶圆制造设备竞争动态报告(英文版)

发布者:wx****44
2026-06-15
4 MB 27 页
半导体
文件列表:
伯恩斯坦:中国半导体设备:2025年中国晶圆制造设备竞争动态报告(英文版).pdf
下载文档

We track the WFE competitive dynamics in China annually (2023, 2024); in this call werefresh the numbers for 2025. Overall localization ratio rose from 16% in 2024 to 21% in 2025; Deposition, Doping and Process Control made the best progress in growth. Lithography and Track remain the two sectors with the lowest localization ratios.In our latest China WFE model update (report and model), we estimated that China’sWFE self-sufficiency reached 21% in 2025 (Exhibit 2). Dry Etch and Deposition are


加载中...

本文档仅能预览20页

继续阅读请下载文档

网友评论>