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OECD经合组织: 2024年芯片、节点和晶圆: 半导体数据收集的分类法报告(英文版)

发布者:wx****66
2024-11-01
7 MB 38 页
半导体
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OECD经合组织: 2024年芯片、节点和晶圆: 半导体数据收集的分类法报告(英文版).pdf
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The semiconductor value chain is essential for modern economies but is prone to disruptions that pose considerable risks. Policy makers need robust data to help address a wide array of issues such as identifying bottlenecks, monitoring the balance between supply and demand of specific semiconductor types, as well as managing disruptions in the value chain. This paper establishes a common taxonomy for semiconductor types and production facilities to enable harmonised data collection and sharin


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